Thank you for joining us at our public workshop!
For those who couldn’t make it this time, we truly hope to see you at our next event.
Here are a few photos from the demo zone to give you a glimpse of the atmosphere!








Join us for an exciting public workshop on „Future Electronics for Industry 4.0 and Medicine 4.0“!
Dear visitors, dear participants,
Program:
10:00 – 11:00 Introduction
- Opening remarks
- Presentation of the Center
- Motivation of the Center, response to societal challenges
11:00 – 12:00
Presentation of the Center’s key areas, success stories
- Technology for healthcare & homecare
- Printed and flexible electronics for I4.0
- Trends in communication technologies
12:00 – 12:45 Elevator pitch
13:00 – 15:00
- a./ Demo zone
- b./ Invited lecture – Placing electrical products on the market
- ISO, Ing. Nekola
15:00 – 16:00 Networking

We meet again in Plzeň, Západočeská universita, 17.-18.6.2025
Invitation – KONSORCIÁLNÍ SETKÁNÍ_pozvánka.pptx
Congratulations to Our Partner MICRORISC!
On April 25, the President of the Czech Republic, Petr Pavel, together with First Lady Eva Pavlová, visited the innovative technology company MICRORISC. We – NCK FEIM – are proud to congratulate our partner on this prestigious visit.
Our presence was also symbolically represented at the event through our roll-up banner, showcasing our continued collaboration and shared commitment to technological progress.

At the end of January, we submitted our annual report for the year 2024 to the Technology Agency of the Czech Republic. In this report, we presented the following key outcomes of our project:
1 Prototype:
- Integrated level sensor with NFC reader.
1 Utility Sample:
- 3D printed ceramic element for electronic applications.
8 Functional Samples:
- Sensor element with a fiber-mirror resonance structure.
- Bedside incontinence sensor.
- Printed capacitive touch button.
- Hybrid electronic system on a flexible substrate.
- Circuit realization of microwave synthesizer.
- Universal communication module with low power consumption for sensors with a 5G interface.
- Ceramic carrier for sensor and functional structures.
- Module for generating electricity from waste heat.
12 Other Outcomes
9 Publications
These results reflect the progress and innovations achieved within the scope of our project, which contribute to advancements in the fields of sensor technology, electronics, and sustainability.
Dear consortium workshop participants, dear partners, we would like to express our thanks for your attendance at our recent event. Your contribution in discussion is to us very valuable and it not just help to improve our cooperation and creation process, but it also made the occasion both enjoyable and memorable.
The event will begin on November 6, 2025, at 10:00 a.m. at the Czech Technical University in Prague. Come and explore the future of electronics with us. We can’t wait to see you there!

FEIM through one of our industrial partners Fortes took part at this year’s Electronica in Munich, one of the largest and most prestigious trade fairs for electronics and technology.
The operational meetings are held on the first Friday of each month. These meetings are intended to coordinate the activities of sub-projects, and therefore, we welcome, in particular, the sub-project leaders and their closest collaborators.